BACON
INDUSTRIES, INC.
各種の特殊用途（ジャイログレード、耐高温、低熱膨張、アルミ、ベリリューム接着、等）のエポキシ・ウレタン・ＵＶキュア接着剤、充填剤を製造しています。
※にはノンマグネティックの製品もございます（型式番号の末尾にＸＭもしくはＣＸＭが付きます）。
EPOXY
ADHESIVES
FLUID
ADHESIVES
FA-8:
Low viscosity fluid for bonding and sealing beryllium,
aluminum and other metals. Meets NASA outgassing
requirements.
FA-14: Very low viscosity and excellent wetting property for bonding fused beryllium oxide, ceramics and other metals.
CI-9: Low viscosity system with excellent color stability for coating, bonding and clear casting applications.
FA-48: Clear, low viscosity and high Glass Transition Temperature for high temperature applications.
FA-49: High bond strength, excellent impact and thermal shock resistance for bonding similar and dissimilar substrates.
FA-56: Clear, low viscosity, good resistance to impact, high strength, low modulus of elasticity.
FLEXIBLE
ADHESIVES
FFA-5:
Low viscosity, clear, flexible general purpose
adhesive.
FFA-8: Medium Viscosity, clear, flexible general purpose adhesive. Also meets USP Class VI for medical applications.
FFA-9: Fast setting room-temperature curing, clear, flexible adhesive.
THIXOTROPIC
ADHESIVES
FTA-17:
Non-sag adhesive with flexibility and hardness providing good
bondstrength.
FTA-101: Flexible adhesive with excellent bond strength to many substrates.
LOW EXPANSION
ADHESIVES
LCA-4:※
Instrument grade adhesive. Low coefficient of thermal expansion and
meets NASA outgassing
requirements.(Gyro-Grade)
LCA4LV:※ Similar to Adhesive LCA-4 except longer pot life and lower viscosity.(Gyro-Grade)
LCA-9:※ Lowest coefficient of thermal expansion adhesive. Meets NASA outgassing requirements.(Gyro-Grade)
LCA-48: Filled version of Adhesive FA-48 for lower thermal expansion for high temperature applications.(Gyro-Grade)
THERMALLY CONDUCTIVE
ADHESIVES
LCA-50:
Thermally conductive filled adhesive with excellent bond strength
and thermal shock resistance.
LCA-127: Thixotropic thermally conductive and electrically insulating adhesive.
ELECTRICALLY CONDUCTIVE
ADHESIVES
LCA-24:
Excellent all around electrically conductive system with better
strength above 160° F and better long term electrical
conductivity stability.
Conducting 20/20: Electrically conductive, silver filled epoxy adhesive with low viscosity at room temperature.
URETHANE
ADHESIVES
FLEXOBOND SERIES of urethanes usually used in the medical,
electronics and aerospace industries.
These are two-part urethanes containing
No TDI, MOCA,
lead or mercury, that cure to a flexible tough material.
They can be cured either at ambient conditions or elevated
temperatures.
FLEXOBOND
202: Rubber modified, fast cure, good
adhesion to difficult bond substrates..
FLEXOBOND
329: Black thixotropic soft adhesive with
high bond strength.
FLEXOBOND
430: A clear, soft urethane
with long work life.
FLEXOBOND
431: A clear material with low
outgassing and used heavily in themedical industry.
FLEXOBOND
442: A thermally conductive
flexible urethane resin system for bonding or filleting glass diodes
or other stress sensitive components while simultaneously providing a
heat flow path. Has excellent electrical properties, flexibility and
is low outgassing. It is being used in aerospace applications on
circuit boards and is designed for high reliability
POTTING/CASTING/HEAT
CURING
P-11:
Highly filled system with low thermal expansion and excellent
machinability.
P-14:
Similar to P-11 except lower expansion and better thermal shock
resistance.
P-182:
Highly filled high performance system with low thermal expansion
and excellent dimensional stability. Will meet NASA outgassing
requirements.
P-84:
General purpose low viscosity potting compound with excellent
dielectric properties.
P-86:
Heat cure system with low exotherm, suitable for large mass,
easily pourable with excellent dielectric properties.
P-103:
General purpose compound with good resistance to impact and
thermal shock.
P-120:
Highly filled heat curing system with excellent over-all
properties. Ideal system for high voltage applications.
ENCAPSULATING
COMPOUNDS
P-175:
Low density syntactic foam epoxy compound with low dielectric
constant and good long term stability.
P-56A:
Mineral filled, thermally conductive compound with excellent
electrical properties.
P-116:
Highly filled thermally conductive system with high Tg, low shrinkage
and low water absorption. Recommended for high temperature
applications.
P-117:
Fire retardant, thermally conductive system with low viscosity and
good thermal shock resistance. Excellent choice for high temperature
applications. Will meet UL-94 VO flame requirements.
P-178:
Filled, thermally conductive compound with good flexibility and
thermal shock resistance. Not recommended for high temperature
applications.
SC-10:
Mineral filled silicone compound with high thermal conductivity,
good thermal stability and excellent electrical properties.
SC-17:
Filled silicone compound with similar cured properties as SC-10
except color, hardness and shorter cure time.
戻る
トップページに戻る
ＳＰＡＭメールが多いので、お問い合わせフォームをご利用下さい。