BACON INDUSTRIES, INC. メーカーのホームページは左の社名をクリックして下さい。
各種の特殊用途(ジャイログレード、耐高温、低熱膨張、アルミ、ベリリューム接着、等)のエポキシ・ウレタン・UVキュア接着剤、充填剤を製造しています
の印のエポキシ樹脂にはノンマグネティックの製品もございます(型式番号の末尾にXMもしくはCXMが付きます)。
EPOXY ADHESIVES

FLUID ADHESIVES
FA-8: Low viscosity fluid for bonding and sealing beryllium, aluminum and other metals. Meets NASA outgassing requirements.

FA-14: Very low viscosity and excellent wetting property for bonding fused beryllium oxide, ceramics and other metals.

CI-9: Low viscosity system with excellent color stability for coating, bonding and clear casting applications.

FA-48: Clear, low viscosity and high Glass Transition Temperature for high temperature applications.

FA-56: Clear, low viscosity, good resistance to impact, high strength, low modulus of elasticity.

FLEXIBLE ADHESIVES
FFA-5: Low viscosity, clear, flexible general purpose adhesive.

FFA-8: Medium Viscosity, clear, flexible general purpose adhesive. Also meets USP Class VI for medical applications.

FFA-9: Fast setting room-temperature curing, clear, flexible adhesive.

THIXOTROPIC ADHESIVES
FTA-17: Non-sag adhesive with flexibility and hardness providing good bondstrength.

FTA-101: Flexible adhesive with excellent bond strength to many substrates.

LOW EXPANSION ADHESIVES
LCA-4: Instrument grade adhesive. Low coefficient of thermal expansion and meets NASA outgassing requirements.(Gyro-Grade)

LCA4LV: Similar to Adhesive LCA-4 except longer pot life and lower viscosity.(Gyro-Grade)

LCA-9: Lowest coefficient of thermal expansion adhesive. Meets NASA outgassing requirements.(Gyro-Grade)

LCA-48: Filled version of Adhesive FA-48 for lower thermal expansion for high temperature applications.(Gyro-Grade)

THERMALLY CONDUCTIVE ADHESIVES
LCA-50: Thermally conductive filled adhesive with excellent bond strength and thermal shock resistance.

LCA-127: Thixotropic thermally conductive and electrically insulating adhesive.

ELECTRICALLY CONDUCTIVE ADHESIVES
LCA-24: Excellent all around electrically conductive system with better strength above 160° F and better long term electrical conductivity stability.

Conducting 20/20: Electrically conductive, silver filled epoxy adhesive with low viscosity at room temperature.

URETHANE ADHESIVES
FLEXOBOND SERIES of urethanes usually used in the medical, electronics and aerospace industries.
These are two-part urethanes containing
No TDI, MOCA, lead or mercury, that cure to a flexible tough material.
They can be cured either at ambient conditions or elevated temperatures.

FLEXOBOND 202: Rubber modified, fast cure, good adhesion to difficult bond substrates.
FLEXOBOND 329:Black thixotropic soft adhesive with high bond strength.
FLEXOBOND 430: A clear, soft urethane with long work life.
FLEXOBOND 431: A clear material with low outgassing and used heavily in the medical industry.
FLEXOBOND 442: A thermally conductive flexible urethane resin system for bonding or filleting glass diodes or other stress sensitive components while simultaneously providing a heat flow path. Has excellent electrical properties, flexibility and is low outgassing. It is being used in aerospace applications on circuit boards and is designed for high reliability

POTTING/CASTING/HEAT CURING
P-182: Highly filled high performance system with low thermal expansion and excellent dimensional stability. Will meet NASA outgassing requirements.
P-84: General purpose low viscosity potting compound with excellent dielectric properties.
P-86: Heat cure system with low exotherm, suitable for large mass, easily pourable with excellent dielectric properties.
P-103: General purpose compound with good resistance to impact and thermal shock..

ENCAPSULATING COMPOUNDS
P-175: Low density syntactic foam epoxy compound with low dielectric constant and good long term stability.
P-56A: Mineral filled, thermally conductive compound with excellent electrical properties.
P-116: Highly filled thermally conductive system with high Tg, low shrinkage and low water absorption. Recommended for high temperature applications.
P-178: Filled, thermally conductive compound with good flexibility and thermal shock resistance. Not recommended for high temperature applications.
SC-10: Mineral filled silicone compound with high thermal conductivity, good thermal stability and excellent electrical properties.
SC-17: Filled silicone compound with similar cured properties as SC-10 except color, hardness and shorter cure time.

戻る
トップページに戻る
SPAMメールが多いので、お問い合わせフォームをご利用下さい。
電話:03−3737−8377 ファックス:03−3737−8379